● 電子級玻璃纖維布增強無機陶瓷填料和碳氫類樹脂復合介質材料
● 具有優異的低介電常數和介電損耗等高頻性能
● 不同頻率下穩定的介電性能

● 低的Z軸膨脹系數,優異的尺寸穩定性


● 微帶和蜂窩基站

● 功率放大器
● 天線

● 高頻無線通訊


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Items Method Condition Unit Typical Value
Dielectric Constant
Process Dk
IPC-TM-650 [1] 10GHz/23℃ - 3.42±0.05
Dielectric Constant
Design Dk
Differential phase length test A - 3.61
Dielectric Constant ICE 61189-2-721 (SPDR) 10GHz/23℃ - 3.68±0.05
Loss Tangent IPC-TM-650 10GHz/23℃ - 0.0030
IEC 61189-2-721 (SPDR) 10GHz/23℃ - 0.0035
TcDkIEC 61189-2-72110GHz (-40-150℃)ppm/℃+50
Volume Resistivity IPC-TM-650 A MΩ·cm 1.1 x 108
Surface Resistivity
A 1.6 x 107
Tg IPC-TM-650 2.4.25 DSC >280
Td ASTM D3850 TGA (5% W.L) 390
CTE (X/Y/Z-axis)IPC-TM-650 2.4.24TMA (30-260℃)ppm/℃12/14/45
Peel Strength
IPC-TM-650 2.4.8288℃/10sN/mm [ln/in]0.72 [4.11]
Water Absorption IPC-TM-650 D-24/34 % 0.06
Thermal Conductivity ASTM D5470 100℃ W/m·K 0.66
Tensile Modulus (LW/CW) ASTM D638 A GPa
Tensile Strength (LW/CW) ASTM D638 A MPa 175/245
Flexural Strength IPC-TM-650 2.4.4 A MPa 260
UL-94 C-48/23/50 Rating V-0


1. [1] For double-sided boards, S7136H (CH1) results in a thickness increase of approximately 0.0007'' (18μm) and the Dk decreases by about 0.1 as the core thickness decreases from 0.0207'' to 0.0107''.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Remarks: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning. The first digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

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